Iiglavu zeLijiejing ze-9-intshi eziphantsi zeChloroprene: Umgangatho omtsha woKhuseleko olucocekileyo lweMveliso yeSemiconductor

Ngokuchasene neemfuno ezingqongqo kakhulu "ezingenasiphako" kwimveliso ye-semiconductor, iiglavu ze-Lijie ze-9-intshi eziphantsi ze-chlorine nitrile ziye zaba zizixhobo zokukhusela eziyimfuneko kwizigaba zokucubungula i-wafer kunye nokupakisha iitships ngenxa yokuba zincinci kakhulu kwi-ionic residue kunye nokusebenza okuphezulu kococeko. Ngokusebenzisa ukucubungula okukhethekileyo, umxholo we-chlorine weglavu ulawulwa ngokungqongqo kwi-≤50ppm—udlula kakhulu umgangatho weshishini we-100ppm. Oku kuthintela ngempumelelo umngcipheko wokugqwala okubangelwa kukufuduka kwe-chloride ion kwiindawo ze-wafer, ukuhlangabezana neemfuno ezingqongqo zomvelisi we-semiconductor zokulawula ungcoliseko oluncinci.

Ngexesha leenkqubo ze-lithography, ukucoceka kweglavu kuchaphazela ngokuthe ngqo ukuchaneka kwengubo ye-photoresist kunye neziphumo zokuvezwa. Yenziwe kwiindawo zokucoca zeKlasi ye-100,000 kwaye isuswa ngothuli lwe-laser, le mveliso ibonisa ukukhutshwa kwamasuntswana omphezulu angaphantsi kwamasuntswana angama-0.2/intshi yesikwere-ihlangabezana nemigangatho yegumbi lokucoca le-ISO Class 3. Oku kuthintela ngokufanelekileyo ukunamathela kwamasuntswana amancinci kumphezulu we-wafer, ngaloo ndlela kunciphisa iziphene ze-lithography. Uyilo oluyi-9-intshi ubude lubonelela ngokugubungela ngokupheleleyo ukusuka esihlahleni ukuya entendeni yesandla. Idityaniswe nesakhiwo se-cuff esithambileyo, iqinisekisa ukuguquguquka kokusebenza ngelixa ithintela ngokufanelekileyo ukuchitheka kothuli kwindawo yokuvula yesingxobo, ihlangabezana neemfuno ezingqongqo zeendawo ezicocekileyo ezinamandla kwiinkqubo ze-lithography.

Ngexesha leenkqubo ezibandakanya ii-reagents ezirhabaxa kakhulu ezifana nokugrumba kunye nokufakelwa kwee-ion, ezi glavu zibonisa ukumelana okungaqhelekanga kweekhemikhali. Emva kovavanyo lokuntywiliselwa iiyure ezingama-24 kwii-reagents eziqhelekileyo ze-semiconductor ezifana ne-hydrofluoric acid kunye ne-phosphoric acid, azibonisi ukudumba okanye ukuqhekeka, kunye nesantya sokutshintsha kobunzima esingaphantsi kwe-0.8%. Oku kubonelela ngokhuseleko oluthembekileyo lwesandla kubasebenzi ngelixa kususa umngcipheko wokungcola kwe-reagent ngenxa yomonakalo weglavu. Iminwe ine-0.02mm yokuthamba okuchasene nokutyibilika okubhalwe nge-laser, okwandisa ukungqubana nge-35% xa kusingathwa ii-wafers ze-intshi ezili-12 kwaye kunciphisa umngcipheko wokutyibilika kwe-wafer nge-60%. Oku kufezekisa ulungelelwaniso phakathi kokhuseleko lokukhusela kunye nokuzinza kokusebenza.

Okwangoku ziqinisekisiwe ngokwemigangatho ye-SEMI F57, ezi glavu zisetyenziswa kwimigca yemveliso emininzi kwiindawo eziphambili zokusekwa kuquka i-SMIC kunye ne-Hua Hong Semiconductor. Zinciphisa amazinga e-wafer scrap abangelwa kukuthintana ngesandla ngama-38%, zizenza ukhetho olufanelekileyo kwimveliso ye-semiconductor yokulinganisela ukhuseleko lwegumbi lokucoca kunye nokusebenza kakuhle.